Publication Details

Microscopic Analysis of The Chips: Chips deprocessing

MALČÍK, D.; DRAHANSKÝ, M. Microscopic Analysis of The Chips: Chips deprocessing. Advanced Science and Technology Letters, Volume 4, 2012, vol. 2012, no. 7, p. 80-85. ISSN: 2287-1233.

Czech title

Mikroskopická analýza čipů: deprocesing čipů

Type

journal article

Language

English

Authors

Malčík Dominik, Ing., Ph.D.
Drahanský Martin, prof. Ing., Ph.D.

Keywords

microscope, chip, chip package, leadframe, decapsulation, bare chip, chip deprocessing, analysis of chips

Abstract

Nowadays many different types of chips are used virtually everywhere in the real world. Sometimes, it is necessary to ensure that a certain chip meets specific requirements. For this reason, it is essential to examine various properties of chips; one of those can be, e.g., the chip security with respect to its physical structure. This paper is a sequel to our previous publication regarding chip decapsulation. A further process of chip deprocessing is presented, so that the reader should be able to decapsulate a chip and also reveal the secrets of bare transistors hidden under different layers. The obtained specimens can be analysed with use of a microscope. Main analysis of such specimens will be the target for our next work.

Published

2012

Pages

80–85

Journal

Advanced Science and Technology Letters, Volume 4, vol. 2012, no. 7, ISSN 2287-1233

Book

The Third International Conference Ubiquitous Computing and Multimedia Applications 2012, Advanced Science and Technology Letters, Volume 7

Publisher

Springer Verlag

Place

Bali - Indonéská republika

BibTeX

@article{BUT96984,
  author="Dominik {Malčík} and Martin {Drahanský}",
  title="Microscopic Analysis of The Chips: Chips deprocessing",
  journal="Advanced Science and Technology Letters, Volume 4",
  year="2012",
  volume="2012",
  number="7",
  pages="80--85",
  issn="2287-1233"
}