Publication Details
International Symposium on Design and Diagnostics of Electronic Circuits and Systems
STAMENKOVIC, Z.; BOSIO, A.; CSEREY, G.; NOVÁK, O.; PLESKACZ, W.; SEKANINA, L.; STEININGER, A.; STOJANOVIC, G.; STOPJAKOVÁ, V. International Symposium on Design and Diagnostics of Electronic Circuits and Systems. In 2019 IEEE International Test Conference. Washington, DC: Institute of Electrical and Electronics Engineers, 2019. p. 1-4. ISBN: 978-1-7281-4823-6.
Czech title
Mezinárodní symposium o návrhu a diagnostice elektronických obvodů a systémů
Type
conference paper
Language
English
Authors
STAMENKOVIC, Z.
BOSIO, A.
CSEREY, G.
Novák Ondřej, prof.Ing., CSc. (CM-SFE)
PLESKACZ, W.
Sekanina Lukáš, prof. Ing., Ph.D. (DCSY)
Steininger Andreas, Prof. Dr.
STOJANOVIC, G.
Stopjaková Viera, prof. Ing., Ph.D.
BOSIO, A.
CSEREY, G.
Novák Ondřej, prof.Ing., CSc. (CM-SFE)
PLESKACZ, W.
Sekanina Lukáš, prof. Ing., Ph.D. (DCSY)
Steininger Andreas, Prof. Dr.
STOJANOVIC, G.
Stopjaková Viera, prof. Ing., Ph.D.
Keywords
symposium, DDECS, electronics, circuits, systems
Abstract
The paper is a contribution to the 50th anniversary celebration of the International Test Conference (ITC) and its Global Test Forum (GTF), which honors the geographic breadth of the test community and highlights the global reach of ITC during the past 50 years. It covers the past, present, and future of the International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS), a symposium which belongs to prominent test technology related events initiated and supported by the ITC.
Published
2019
Pages
1–4
Proceedings
2019 IEEE International Test Conference
ISBN
978-1-7281-4823-6
Publisher
Institute of Electrical and Electronics Engineers
Place
Washington, DC
DOI
UT WoS
000540385000026
EID Scopus
BibTeX
@inproceedings{BUT162595,
author="STAMENKOVIC, Z. and BOSIO, A. and CSEREY, G. and NOVÁK, O. and PLESKACZ, W. and SEKANINA, L. and STEININGER, A. and STOJANOVIC, G. and STOPJAKOVÁ, V.",
title="International Symposium on Design and Diagnostics of Electronic Circuits and Systems",
booktitle="2019 IEEE International Test Conference",
year="2019",
pages="1--4",
publisher="Institute of Electrical and Electronics Engineers",
address="Washington, DC",
doi="10.1109/ITC44170.2019.9000137",
isbn="978-1-7281-4823-6",
url="https://www.fit.vut.cz/research/publication/12200/"
}