Publication Details

Exploitation of Scattered Context Grammars to Model VLIW Instruction Constraints

KŘOUSTEK, J.; ŽIDEK, S.; KOLÁŘ, D.; MEDUNA, A. Exploitation of Scattered Context Grammars to Model VLIW Instruction Constraints. In Proceedings of the 12th Biennial Baltic Electronics Conference. Tallinn: Institute of Electrical and Electronics Engineers, 2010. p. 165-168. ISBN: 978-1-4244-7357-1.
Czech title
Využití gramatik s rozptýleným kontextem k modelování omezení instrukcí VLIW procesoru
Type
conference paper
Language
English
Authors
Křoustek Jakub, Ing., Ph.D.
Židek Stanislav, Ing.
Kolář Dušan, doc. Dr. Ing. (DIFS)
Meduna Alexandr, prof. RNDr., CSc. (DIFS)
URL
Keywords

scattered context grammar, SCG, VLIW, assembler, conflicts, latency

Abstract

More and more nowadays data processing System-on-Chip (SoC) devices exploit the very long instruction word (VLIW) technology. The high performance of VLIW processors is achieved by a high instruction level parallelism. Program execution is scheduled statically at compilation time. Therefore, there is no need for run-time control mechanisms and hardware can be relatively simple. On the other hand, all constraints checks must be done by the compiler. This paper describes formal method for modeling instruction level limitations of these processors. This method is based on scattered context grammars that generate proper assembler code. This concept has two advantages - formal description of the dependency checking process and high reduction of description complexity over other methods.

Published
2010
Pages
165–168
Proceedings
Proceedings of the 12th Biennial Baltic Electronics Conference
ISBN
978-1-4244-7357-1
Publisher
Institute of Electrical and Electronics Engineers
Place
Tallinn
DOI
EID Scopus
BibTeX
@inproceedings{BUT34822,
  author="Jakub {Křoustek} and Stanislav {Židek} and Dušan {Kolář} and Alexandr {Meduna}",
  title="Exploitation of Scattered Context Grammars to Model VLIW Instruction Constraints",
  booktitle="Proceedings of the 12th Biennial Baltic Electronics Conference",
  year="2010",
  pages="165--168",
  publisher="Institute of Electrical and Electronics Engineers",
  address="Tallinn",
  doi="10.1109/BEC.2010.5630284",
  isbn="978-1-4244-7357-1",
  url="https://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=5630284"
}
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