Publication Details
Microscopic Analysis of The Chips: Chips deprocessing
Drahanský Martin, prof. Ing., Ph.D.
microscope, chip, chip package, leadframe, decapsulation, bare chip, chip deprocessing, analysis of chips
Nowadays many different types of chips are used virtually everywhere in the real world. Sometimes, it is necessary to ensure that a certain chip meets specific requirements. For this reason, it is essential to examine various properties of chips; one of those can be, e.g., the chip security with respect to its physical structure. This paper is a sequel to our previous publication regarding chip decapsulation. A further process of chip deprocessing is presented, so that the reader should be able to decapsulate a chip and also reveal the secrets of bare transistors hidden under different layers. The obtained specimens can be analysed with use of a microscope. Main analysis of such specimens will be the target for our next work.
@article{BUT96984,
author="Dominik {Malčík} and Martin {Drahanský}",
title="Microscopic Analysis of The Chips: Chips deprocessing",
journal="Advanced Science and Technology Letters, Volume 4",
year="2012",
volume="2012",
number="7",
pages="80--85",
issn="2287-1233"
}