Publication Details

Improving the Physical Security of Microchips

MALČÍK, D.; DRAHANSKÝ, M. Improving the Physical Security of Microchips. International Journal of Security and Its Applications, 2019, vol. 13, no. 3, p. 17-28. ISSN: 2207-9629.
Czech title
Zvyšování fyzické bezpečnosti mikročipů
Type
journal article
Language
English
Authors
Malčík Dominik, Ing., Ph.D.
Drahanský Martin, prof. Ing., Ph.D.
URL
Keywords

hybrid integrated circuits, integrated circuits, reverse engineering, security,
three-dimensional integrated circuits

Abstract

Nowadays, microchips are virtually everywhere, from simple home devices to
confidential military equipment. We must not forget the medical systems that have
a great impact on our quality of life as well. As can be seen, the importance of
these tiny integrated circuits is immense. Preserving the reliability of these
devices and the confidentiality of data these devices are processing is
absolutely substantial. The integrated circuit (IC) industry has been rapidly
evolving in recent decades and employing ICs is becoming normal and inevitable in
nearly all aspects of our lives. The initial IC evolution era paid attention
primarily to the technological evolution itself. Aspects like security were
always one step back due to the fallacious feeling of the inherent security of
these very tiny components. After realizing that the opposite is true, we have to
focus on securing the critical devices against tampering, information theft,
counterfeiting, etc. In scope of this paper, it means especially hindering of
physical attacks on the chips.

Published
2019
Pages
17–28
Journal
International Journal of Security and Its Applications, vol. 13, no. 3, ISSN 2207-9629
DOI
UT WoS
000511120400003
BibTeX
@article{BUT159978,
  author="Dominik {Malčík} and Martin {Drahanský}",
  title="Improving the Physical Security of Microchips",
  journal="International Journal of Security and Its Applications",
  year="2019",
  volume="13",
  number="3",
  pages="17--28",
  doi="10.33832/ijsia.2019.13.3.03",
  issn="2207-9629",
  url="http://article.nadiapub.com/IJSIA/vol13_no3/3.html"
}
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