Publication Details

Efficient Lossy Compression of Ultrasound Data

KLEPÁRNÍK, P.; ZEMČÍK, P.; JAROŠ, J. Efficient Lossy Compression of Ultrasound Data. In 2017 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2017. Bilbao: Institute of Electrical and Electronics Engineers, 2018. p. 232-237. ISBN: 978-1-5386-4662-5.
Czech title
Efektivní ztrátová komprese ultrazvukových dat
Type
conference paper
Language
English
Authors
URL
Keywords

signal compression, ultrasound simulation, high intensity focused ultrasound, k-Wave toolbox

Abstract

Large-scale numerical simulations of high-intensity focused ultrasound (HIFU), important for model-based treatment planning, generate large amounts of data. Typically, it is necessary to save hundreds of gigabytes during simulation. We proposed a novel algorithm for time varying simulation data compression specialized for HIFU. Our approach is especially focused on the on-the-fly parallel data compression during simulations. Now, we are able to compress 3D pressure time series of linear and nonlinear simulations with very promising compression ratios and errors (over 80 % of the space can be saved with an acceptable error). The proposed compression will be helpful for significant reduction of resources, such as CPU time, storage space, network bandwidth, etc., enabling better treatment planning using fast volume data visualizations. The paper describes the proposed method, its experimental evaluation, and comparison to the state of the art.

Published
2018
Pages
232–237
Proceedings
2017 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2017
ISBN
978-1-5386-4662-5
Publisher
Institute of Electrical and Electronics Engineers
Place
Bilbao
DOI
UT WoS
000437165400042
EID Scopus
BibTeX
@inproceedings{BUT154994,
  author="Petr {Klepárník} and Pavel {Zemčík} and Jiří {Jaroš}",
  title="Efficient Lossy Compression of Ultrasound Data",
  booktitle="2017 IEEE International Symposium on Signal Processing and Information Technology, ISSPIT 2017",
  year="2018",
  pages="232--237",
  publisher="Institute of Electrical and Electronics Engineers",
  address="Bilbao",
  doi="10.1109/ISSPIT.2017.8388647",
  isbn="978-1-5386-4662-5",
  url="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8388647&isnumber=8388305"
}
Files
Back to top