Project Details
Long Life Power Platforms for Internet of Things
Project Period: 1. 6. 2023 – 31. 5. 2026
Project Type: grant
Code: 9A23012
Agency: Evropská unie
Program: HORIZON EUROPE
Energy harvesting, power management, IoT, asset tracking
In LoLiPoP IoT innovative Long Life Power Platforms are developed that enable
retrofit of wireless sensor network (WSN) In LoLiPoP IoT innovative Long Life
Power Platforms are develloped that enable retrofit of wireless sensor network
(WSN) modules in in IoT applications. They can be applied to APPLICATIONS of
industry 4.0, smart mobility and building energy efficiency. Create an ecosystem
of developers, integrators and users to develop these platforms thinking about
power/battery life, ease of installation and maintenance.
ACKNOWLEDGMENT: LoLiPoP IoT is supported by the Chips Joint Undertaking and its
members, including the top-up funding by National Authorities under Grant
Agreement 101112286. Funded by the European Union. Views and opinions expressed
are however those of the author(s) only and do not necessarily reflect those of
the European Union or the granting authority. Neither the European Union nor the
granting authority can be held responsible for them.
Bambušek Daniel, Ing. (DCGM)
Beran Vítězslav, doc. Ing., Ph.D. (DCGM)
Dobeš Petr, Ing. (DCGM)
Fajčík Martin, Ing., Ph.D. (DCGM)
Hájková Gabriela, Mgr. (DFIT)
Halas Jaromír (CVT)
Heřmanský Hynek, prof. Ing., Dr. Eng. (DCGM)
Homoliak Ivan, doc. Ing., Ph.D. (DITS)
Jírovec Martin, Ing. (DFIT-Dean)
Juránková Markéta, Ing., Ph.D. (DCGM)
Kapinus Michal, Ing., Ph.D. (DCGM)
Klement Dominik, Bc. (DCGM)
Kula Michal, Ing., Ph.D. (DCGM)
Lojda Jakub, Ing., Ph.D. (DCSY)
Matýšek Michal, Ing. (DCGM)
Páleník Martin, Mgr. (DCGM)
Pánek Richard, Ing., Ph.D. (DCSY)
Pavlus Ján, Ing. (DCGM)
Pečiva Jan, Ing., Ph.D. (DCGM)
Peng Junyi (DCGM)
Rozsíval Michal, Ing. (DITS)
Starka Tomáš, Ing. (DCGM)
Staroň Patrik, Bc. (DCGM)
Strnadel Josef, Ing., Ph.D. (DCSY)
Šimek Václav, Ing. (DCSY)
Španěl Michal, doc. Ing., Ph.D. (DCGM)
2026
- LOJDA, J.; STRNADEL, J.; SMRŽ, P.; ŠIMEK, V. Multi-Partner Project: LoLiPoP-IoT - Design and Simulation of Energy-Efficient Devices for the Internet of Things. Lyon: Institute of Electrical and Electronics Engineers, 2026. Detail
2024
- BUDINSKÝ, R.; STANČÍKOVÁ, I.; HOMOLIAK, I. Mitigating Undercutting Attacks: Fee-Redistribution Smart Contracts for Transaction-Fee-Based Regime of Blockchains with the Longest Chain Rule. In 2023 IEEE International Conference on Blockchain (Blockchain). Danzhou, China: Institute of Electrical and Electronics Engineers, 2024.
p. 25-32. ISBN: 979-8-3503-1929-3. Detail - HOMOLIAK, I.; PEREŠÍNI, M. SoK: Cryptocurrency Wallets - A Security Review and Classification based on Authentication Factors. In 2024 IEEE International Conference on Blockchain and Cryptocurrency (ICBC) - Proceedings. Dublin: Institute of Electrical and Electronics Engineers, 2024.
p. 1-8. ISBN: 979-8-3503-1674-2. Detail - LOJDA, J.; STRNADEL, J.; ŠIMEK, V.; SMRŽ, P.; HAYES, M.; POPP, R. The LoLiPoP-IoT Project: Long Life Power Platforms for Internet of Things. In Proceedings - 2024 27th Euromicro Conference on Digital System Design, DSD 2024. Paris: Institute of Electrical and Electronics Engineers, 2024.
p. 604-611. ISBN: 979-8-3503-8038-5. Detail - LOJDA, J.; STRNADEL, J.; SMRŽ, P.; ŠIMEK, V. First Steps Towards Unified Low-Power IoT Design: The "DYNAMIC" Framework. 2024 IEEE East-West Design and Test Symposium, EWDTS 2024 - Proceedings. Yerevan: Institute of Electrical and Electronics Engineers, 2024.
p. 1-6. ISBN: 979-8-3315-1576-8. Detail - STRNADEL, J.; LOJDA, J.; SMRŽ, P.; ŠIMEK, V. On SMC-Based Dependability Analysis in LoLiPoP-IoT Project. Steffen, B. (eds) Bridging the Gap Between AI and Reality (AISolA 2024). Lecture Notes in Computer Science. Limenas Hersonissou: Springer Nature Switzerland AG, 2024.
p. 420-425. ISBN: 978-3-031-75434-0. ISSN: 0302-9743. Detail - STRNADEL, J.; LOJDA, J.; SMRŽ, P.; ŠIMEK, V. Machine Learning in Context of IoT/Edge Devices and LoLiPoP-IoT Project. In Proceedings of 32nd Austrian Workshop on Microelectronics (Austrochip 2024). Vienna: Institute of Electrical and Electronics Engineers, US, 2024.
p. 1-4. ISBN: 979-8-3315-1617-8. Detail